Power chips are attached to exterior circuits through packaging, and their efficiency depends upon the support of the packaging. In high-power scenarios, power chips are usually packaged as power components. Chip affiliation describes the electric link on the top surface area of the chip, which is generally aluminum bonding wire in standard components. ^
Standard power module plan cross-section
Currently, commercial silicon carbide power components still mainly use the product packaging modern technology of this wire-bonded typical silicon IGBT module. They encounter problems such as huge high-frequency parasitic parameters, inadequate warm dissipation capability, low-temperature resistance, and inadequate insulation toughness, which limit making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these troubles and totally manipulate the substantial possible advantages of silicon carbide chips, numerous new product packaging innovations and services for silicon carbide power components have actually arised over the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cord bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold wires to copper wires, and the driving pressure is cost reduction; high-power gadgets have actually created from aluminum wires (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with traditional bonding product packaging methods, Cu Clip innovation has the adhering to advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain level, changes the conventional cord bonding approach in between the chip and the pins. For that reason, an unique package resistance value, higher current circulation, and far better thermal conductivity can be gotten.
2. The lead pin welding area does not need to be silver-plated, which can completely conserve the expense of silver plating and bad silver plating.
3. The item appearance is totally consistent with normal products and is mainly utilized in servers, portable computer systems, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding approach is much more pricey and complicated, yet it can accomplish better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad makes use of a Clip method, and eviction makes use of a Wire method. This bonding technique is a little less expensive than the all-copper bonding method, saving wafer area (applicable to very tiny gate locations). The process is less complex than the all-copper bonding approach and can get far better Rdson and far better thermal impact.
Supplier of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding brass and copper, please feel free to contact us and send an inquiry.
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